The device is placed in a new package type, being made available and accepted by JEDEC, called the Fine Pitch Quad Flat No Lead package.
该装置被放置在一个新的封装类型，正在提供和由JEDEC接受，所谓的精细间距方形扁平无引线封装的。
SB2100 Pinout:· Single 3.0 V read, program, and erase Minimizes system level power requirements · Compatible with JEDEC-standard commands Uses same software commands as E2PROMs · Compatible with JEDEC-standard world-wide pinouts 48-pin TSOP (Package suffix: PFTN C Normal Bend Type) 48-ball FBGA (Package suffix: PBT) 48-ball SCSP (Package suffix: PW)· Minimum 100, 000 program/erase cycles · High performance 90 ns maximum access time · Sector erase architecture One 8K word, two 4K words, one 16K word, and fifteen 32K words sectors in word mode One 16K byte, two 8K bytes, one 32K byte, and fifteen 64K bytes sectors in byte mode Any combination of sectors can be concurrently erased.
SB2100引脚说明：·单3.0 V的读，编程和擦除符合JEDEC标准的命令用途为E2PROMs·兼容相同的软件符合JEDEC标准的全球性管脚48针的TSOP（我的命令，缩短了系统级电源要求·兼容）（包后缀：PFTN C正常弯曲型）48球FBGA封装48球的采购委员会·最小100，000编程/擦除周期·高性能90 ns的最大访问时间·扇区擦除架构一个8K的话，两个4K的话，一个16K的字，15个32K的字，词模式部门之一16K的字节，8K的两个字节，一个32K的字节，64K字节和15个部门在字节模式任何行业的组合可以同时被删除。
The modal tests of PCB and PCB assembly (free boundary condition and fixed boundary condition) were carried out. The equivalent elastic modulus and damping parameters of PCB can be gained, and the fixed boundary condition of finite element model was also determined. These will help to the following work. Second, drop impact tests of three different heights were carried out. Strains and acceleration responses of PCB were measured. Failed BGA packages of different test conditions were dyeing, and cross section analysis of failed solder joints was conducted.
针对JEDEC标准试件的局限性，提出了设计便于统计学研究焊点可靠性的试验试件的构想，利用有限元模态分析方法确定并验证了用圆形PCB组件替代JEDEC标准试件的可行性；通过一系列模态试验和有限元模态分析，确定了圆形PCB组件的相关试验参数，这不仅为跌落碰撞下PCB组件有限元模拟确定了较为合理准确的有限元模型，而且为正确地评价跌落碰撞下PCB组件的可靠性问题奠定了基础。2。
The modal tests of PCB and PCB assembly (free boundary condition and fixed boundary condition) were carried out. The equivalent elastic modulus and damping parameters of PCB can be gained, and the fixed boundary condition of finite element model was also determined. These will help to the following work. Second, drop impact tests of three different heights were carried out. Strains and acceleration responses of PCB were measured. Failed BGA packages of different test conditions were dyeing, and cross section analysis of failed solder joints was conducted. It was found in our drop tests that the root cause of lead-free solder joints under drop impact was the combined effect of mechanical shock and PCB bending vibration.
针对JEDEC标准试件的局限性，提出了设计便于统计学研究焊点可靠性的试验试件的构想，利用有限元模态分析方法确定并验证了用圆形PCB组件替代JEDEC标准试件的可行性；通过一系列模态试验和有限元模态分析，确定了圆形PCB组件的相关试验参数，这不仅为跌落碰撞下PCB组件有限元模拟确定了较为合理准确的有限元模型，而且为正确地评价跌落碰撞下PCB组件的可靠性问题奠定了基础。
1 Method for Measurement of Power Device Turn-Off Switching Loss.
该X60008EIS8 - 50，X60008EIS8 - 50和X60008EIS8 - JEDEC标准号分别为24-1方法测试电力设备关断开关损耗的测量50S的。
JEDEC? The current into an input terminal when a specified high-level voltage is applied to that input.
一个规定的高电平电压信号加到一个输入端时，流进该输入端的电流。
The two companies started participating in standardization efforts for DDR2.0 through the JEDEC Solid State Technology Association, last month.
上个月，两家公司便已经参与到了由JEDEC固态技术协会牵头的DDR2.0NAND接口标准化工作中去。
A Case Study of Problems in EIA/JEDEC HBM ESD Test Standard
静电放电人体模型测试标准EIA/JEDEC中的问题研究
JEDEC? The input threshold voltage when the input voltage is falling.
在输入电压下降时的输入门限电压。
Samsung now plans to work closely with a number of server makers to help insure completion of JEDEC standardization of DDR4 technologies in the second half of this year.
三星目前正计划与多家服务器厂商合作，以尽快在今年下半年完成DDR4JEDEC标准的制定工作。
JEDEC? The voltage level at an output terminal with input conditions applied that, according to the product specification, will establish a high level at the output.
根据产品技术规范，随加到输入端的情况在输出端的电平，将在输出端建立一个高电平。
JEDEC – A power supply that acts as a reference for determining internal threshold voltages, but does not supply any substantial power to the device.
为确定内部门限电压而提供参考的电源，但它并非为器件提供实际的电源（电力）。
Secondly, the using of JEDEC Standard SDP three-byte command sequence can reduce the accessing EEPROM by accident and improve the dependability of saving data.
其次SST29EE020采用JEDECStandardSDP三字节命令时序减少了对EEPROM的误操作，提高了数据保存的可靠性。
After the system start, MTD will identify flash chip supporting CFI or JEDEC interface. And it can read CFI query structure by querying command.
MTD在系统启动后自动识别支持CFI或JEDEC接口的FLASH芯片，之后通过查询命令读取CFI查询结构。
Leaded and lead-free BGA (ball grid array) components were tested in board level drop test defined in the JEDEC (Joint Electron Device Engineering Council) standard.
按照JEDEC标准对板级跌落实验的要求测试了有铅和无铅焊点的球栅阵列封装。
The chips on board would not damage at the same time in finite drop. Large number of studies show that the chip closed to the JEDEC board bolt location (U1) is the easiest damage part.
有限次跌落并不使板上的芯片同时失效，很多研究表明在跌落试验板靠近角边螺栓孔位置的芯片最易于破坏。
In case JEDEC class 5a or 6, more than 24 h
如果在JEDEC的5A或6级，超过24小时
The command set required to control the memory is consistent with JEDEC standards.
设置所需的命令来控制内存的JEDEC标准相一致。
Tested in accordance with JEDEC Standard 22, Test Method A114B.
按照JEDEC标准测试22，A114的测试方法- B的。
Tested in accordance with JEDEC Standard 22, Test Method C101A.
在符合JEDEC标准测试22，测试方法C101 -甲根据。