Three devices with different die attached material pure Epoxy, the Epoxy +YAG, and the Epoxy +RG, respectively. Followed, adding the phosphor in die-attached epoxy for die bonding, and then baked the optical devices. Finally, mix the concentrations of FA565 and RG phosphor which are 90% and 10% in LED encapsulant layer, respectively.
三种元件分别使用单纯Epoxy固晶,Epoxy+YAG固晶,使用黄绿光之钇铝石榴石(Yttrium aluminum garnet,YAG),三为Epoxy+RG固晶,使用红绿光(Red and Green,RG)之矽酸盐类两款萤光粉,混入LED封装制程中之固晶用胶,烘烤后,再以Silicone加入适量掺有90 %的FA565黄色萤光粉、10 % RG萤光粉与的混合,做为填充层。