Since 2002, is committed to the development, production, sales EL EL-chip market, and Fobus Lighting cooperation with the United States, the introduction of foreign automated production technology, Dr. John Tedesc lead, carrying a large number of electronic engineers and technical experts, the product On the basis of existing technology to improve its lower power consumption more evenly luminous, light weight, safe and convenient advantages, won the praise of customers and the industry enjoyed a good reputation.
自2002年开始致力于研发、生产、销售EL场致发光片，并与美国Fobus Lighting合作，引进国外全自动生产技术，在John Tedesc 博士领衔下，携一大批电子工程师和技术专家，在产品原有技术的基础上改进，使其发光更均匀耗电量更低、重量轻薄、安全方便等优点，赢得了客户的一致好评，并在同行业中享有良好信誉。
When the volume of eutectic solder was smaller than V critical, the stand off height of solder joint was equal to the radius of solder bump on chip; when the volume is greater than V critical, the stand off height was greater than the radius of solder bump and increased with the increase of eutectic solder volume, Besides, the regression model was presented for stand off height of solder joints vs. eutectic solder volume, substrate pad size, solder bump size and chip weight in dimensionless form.
另外 ，采用无量纲的形式给出了焊点高度与共晶焊料量、焊盘尺寸、芯片凸点的尺寸，芯片重量之间的关系模型，研究结果对倒装焊焊点形态的控制、工艺参数的优化和提高焊点可靠性具有指导意义。1 引言半导体集成技术和微细加工技术的迅速发展，推动了电子器件的封装技术向高密度、高可靠性方向发展。
All relevant Buffett also questioned the value of oil regression disappeared, and now look, the soaring international oil prices did not stop the sharp fall in oil price to fall all the way, while oil production capacity does not wish outbreak growth, more tragically, is the large blue-chip return of A shares by the birth of a bubble have utterly destroyed a big bull market, since 2008 China`s stock market with China, like the oil price is going through overturned weight to the throes.
所有有关巴菲特也质疑石油回归价值的消失，现在来看，国际石油价格飙升并没有阻止石油价格的急剧下降到一路下跌，而石油生产能力不希望爆发增长，更大的悲剧，是大蓝的泡沫诞生芯片回归A股已经彻底摧毁了一个大牛市，2008年以来中国的股市同中国石油价格一样，正在经历推翻重来的痛苦。
Chip weight has a significant effect on the reliability of solder joints, whereas pad diameter and stencil thickness have little effects on the reliability.
方差分析表明，芯片配重质量对1.0mm引脚间距PBGA器件焊点的可靠性有显著的影响，而焊盘直径和钢网厚度对可靠性无显著影响。
I plant without the high-pressure gas production by spraying machine整机microcomputer chip control, the products small size, light weight, portable, low noise, atomized strong, smooth coating evenly, easy to operate, high efficiency.
我厂生产的高压无气喷涂机整机产用微电脑芯片控制，该产品体积小，重量轻，携带方便，噪音低，雾化强，涂层光滑均匀，操作方便，效率高等特点。
Each chip in the park will contain the saguaro's location, elevation, height, weight and general health.
公园中的每颗芯片都包含了巨人柱的位置、海拔、身高、体重和健康状况。
Finally, this paper verifies the functions of electronic analytical balance which has been improved and analyzes the errors. Firstly, it calibrates electronic balance timely by the single-chip microcomputer controlling the motor drive which drives the standard weight.
最后对改进后的电子天平性能进行了检定，并且进行了误差分析。首先，通过单片机来控制电机带动标准砝码，定时的对电子天平进行校准。
This method, using current-mode continuously time-modeling, was well adaptive to the VLSI technique, had the in-chip error backward propagation learning function and simplified the corrected weight value of BP new computation, so that provided the circuits designed by the authors with PSPICE emulational result.
硬件系统适合利用VLSI技术，具有片内误差反向传播学习功能，能简化BP新算法修正权值，对所设计的电路提供了PSPICE仿真结果，结果表明硬件实现方法的可行性。
The millimeter wave multi-chip module (MCM) is attributed the technology of hybrid integrated circuit, and it can effectively decrease systemic volume and weight.
毫米波多芯片组件（MCM）是一种混合集成电路技术，是减小系统体积和重量的有效途径。
It is proved in practice that the charge circuit designed with the MAX 745 charge control chip is concise, safe and reliable. It can satisfy the requirement of large current, high precision, small volume and light weight by portable computers.
实际应用证明，用MAX745控制芯片设计的充电器电路简洁、安全、可靠，能满足便携式计算机所需的大电流、高精度、体积小、质量轻的要求。
LED chip sorting machine is one kind of high frequency working machines. High speed and light weight is the developing direction of its sorting mechanism.
LED芯片分选机属于一种高频工作机械，其分选机构向着高速化和轻量化发展。
HVIC makes it possible to fabricate high voltage devices and low voltage control circuit in one chip. It also makes power IC simpler and the price, weight and volume of power IC decrease.
将高压器件和低压器件集成在同一芯片上的高压集成电路的出现，使功率电路得以简化，在价格、体积、重量等方面都大大减小。
Single-chip micro-computer, referred to as SCM, it has a simple structure, light weight, low price advantage.
单片微型计算机简称单片机，它具有结构简单，重量轻，价格低等优点。
The reliability of PBGA solder joints under the multi-technology parameters combination (the specification size, the chip weight, the pad diameter and the stencil thickness) is studied.
对多工艺参数（样件规格、芯片配重、焊盘直径和钢网厚度）组合下的PBGA器件焊点可靠性进行了研究，获得了多工艺参数对PBGA焊点可靠性的影响顺序及其显著性结论。
Polypropylene chip with melting index 3, relative molecular weight close to 300000 and distribution index less than 7 was selected to produce PP filament on imported equipment by one step high speed spinning process.
采用熔融指数为3，分布指数小于7，相对分子质量近30万的聚丙烯切片在进口设备上一步法高速纺生产中旦丙纶长丝。
In this design, the 32bit MCU LPG2132 are used as the kernel chip, which is based on ARM technology and runs faster than others, meanwhile, it has the ability of expanded using in the future because of abundant peripheral resource; By comparing to other products at present, the design choose ENC28J60 as the network interface module, which is produced by Microchip and has the advantage in hardware and software design; In this design, theμC/OS-II operation system is transplanted into LPC2132 to optimize the control ability、anti-jamming ability and real-time function; The light-weight TCP/IP stacks lwIP is also transplanted into the operation system to come true the communication on Internet.
本文在查阅大量国内外资料文献的基础上，分析了当前市场上远程智能仪器设备的发展现状，经过分析其优缺点，确定了远程数据采集系统的设计方案：采用基于ARM技术的32位处理器LPC2132作为系统硬件平台主控芯片，其数据处理能力和丰富的外围设备，满足数据采集和网关转换的需要，同时预留了大量端口资源，方便未来功能扩展；经过与市场上同类产品比较，选用了Microchip公司最新出品的ENC28J60对网络通讯模块进行设计，节省了大量系统资源并简化了软件设计；将μC／OS-Ⅱ操作系统移植到LPC2132中，利用嵌入式操作系统的可裁剪性、可移植性和多任务等特点，不仅使其控制性能大幅度提高，而且使抗干扰能力和实时性显著增强；将嵌入式TCP／IP协议栈1wIP移植到操作系统中，节省内存资源，满足了互联网通讯的协议要求。