According to the thermodynamic parameters, the main force between HSA and FA or PAE was deduced to be hydrogen bonding.
根据热力学参数推测出FA，PAE与HSA之间的作用力主要为氢键作用。
And the content of chromate and polyvinyl alcohol also affect the bonding force between the coating and matrix.
涂液中铬酐和聚乙烯醇的含量还影响涂层与基体之间的结合力，必须适当控制。
According to the calculated adsorption enthalpy, comparison of the adsorption isotherms in different conditions, and theoretical calculation, hydrogen bonding was elucidated to be the principal driving force for the adsorption, and the oxygen atom of ether bond of the prepared resin forms strong hydrogen bonding with the hydrogen atom of phenolic hydroxyl group of phenol.
通过吸附焓的计算、不同条件下吸附等温线的比较以及理论计算等方法，确证氢键是甲氧基修饰的大孔交联树脂吸附正己烷中苯酚的主要驱动力，树脂骨架上负载的醚氧原子与苯酚的酚羟基氢原子形成了强烈氢键。
The force on the bonded interface of the silicone rubber and metal were proved by solution attack analysis to include dispersion force and chemical bonding force.
溶液浸蚀分析证明硅橡胶与金属粘接界面的相互作用力包括色散作用和化学键作用。
The plastic extruded board needs to be finished in order to enhance the bonding force between mortar and plastic extruded board.
挤塑板需经过表面加工处理，以提高粘结砂浆与挤塑板的结合力。
The experimental results showed that the interface moisture condition is an important factor to influence the bonding force of the interface between new and old concrete.
结果表明，界面干湿状态会影响界面结合强度，干燥状态对新旧混凝土结合最为有利。
Current flip chip bonding technologies are included Solder!BThermo-sonic, Thermo-compression, ACF/ACP, NCP!Ketc. And Thermo-sonic flip-chip bonding technology is using ultrasonic energy to eutectic bond connections between chip and substrate. And this technology has unique advantages, including short bonding time, low bonding temperature, light bonding force and flux-less process. Now, this technology has applied to many kinds of optoelectronic and wireless product.
现行成熟的覆晶键合技术有：Solder、Thermo-sonic，Thermo-compression，ACF/ACP，NCP等，其中热超音波覆晶黏晶技术是运用超音波能量进行芯片与基板之间接点的熔接，具有快速、低温熔接、轻黏晶置放力以及不需助焊剂等制程优势，至今已成功应用于各式光电与通讯产品。
Part Ⅱ: Comprehesive analysis of multi factors affecting axil shear bonding force to cast metal resin-bonded bridge. Select fresh and infact extracted human upper incisor teeth to make 36 simulate models with high strength dental stone.
选择新鲜完整的离体人上中切牙和上侧切牙，与超硬石膏一起制成相同的一颗中切牙缺失的36个模拟模型，随机分为A、B组，每组18个模型，B组用于与A组相同的重复实验。
METHODS: TNZS alloy was treated with micro-arc oxidation. The surface morphology was observed with SEM. The phase, elemental composition, microhardness, thickness, bonding force, surface energy and roughness of the film were characterized respectively.
对钛铌锆锡合金试件表面进行微弧氧化处理，观察其表面形貌，分析膜层的相位和元素组成，检测膜层硬度、厚度、膜层以及基体的结合强度、表面能、表面粗糙度。
And a FE model of bonding interface was developed to study the stressdistribution on bonding interface. The simulation results show that theperiphery of bonding interface is in a better condition for surface layerbreaking, debris removing and atom diffusion than other area, which is asignificant cause of ring-shaped bonding pattern formation.5 Some preliminary understanding about bonding mechanism wasobtained. With the bonding force and ultrasonic, the stress on bump/pad canreach several MPa, which causes dislocation proliferation, plastic flow ofbumps and pads and oxide film broken on bonding interface. During theplastic flow, the oxide film debris are expelled from bonding interface and theAu/Ag atoms are contacted directly, which results in initial bonding strengthby forming chemical bond and physics bond (adsorptioncaused by van der Waals force).
通过建立了键合界面的有限元模型，研究了键合过程中不同状态下键合界面的应力分布，发现接触面边缘的应力远大于其它位置，更有利于氧化膜去除、驱动原子扩散，并形成键合强度，这是产生环状键合界面的重要原因。5获得了键合机理的初步认识：在键合力和超声作用下，金凸点／焊盘中产生高达数百MPa的应力，使金凸点和焊盘中的位错大量增殖、产生塑性流变、接触界面的氧化膜破裂；金凸点／焊盘在塑性流动过程中，将氧化膜碎片带出接触面，使键合界面裸露的金和银原子直接接触，一方面通过电子云共享形成化学键，另一方面形成物理键，生成最初始的键合强度。
Since the establishment of 89, after 10 years of development, with strong technical force and the accumulation of years of experience in production management, quality of the produce sections of bonding Chair, Zhuanyi accessories, plastic handrails, wood handrails, curved wood handrails, Of the planes, office furniture sofa handrails and metal accessories, and other plastic products.
自89年成立以来，经过十多年的发展，以雄厚的技术力量和积累多年的生产管理经验，生产出各款优质的胶合椅系列、转椅配件、塑胶扶手、实木扶手、弯木扶手、会议架、办公沙发扶手及家具五金塑料配件等各系列产品。
RESULTS: The surface was rough and multiporous, the film was composed of Ti, Nb, Zr, Sn, O, Ca and P elements. XRD indicated that the phases in the film were rutile and anatase phase TiO2. The feature of the film was 414HV hard and 26 μm thick, with a bonding force of 32N, 62.9 mJ/m^2 surface energy and roughness of 1.175μm.
结果：钛铌锆锡合金经微弧氧化处理可在其表面形成粗糙、多孔的氧化膜，氧化膜由Ti、O、Ca、P、Zr、Nb、Sn7种元素组成，金相结构主要为锐钛矿相的TiO2和金红石相TiO2，膜层硬度414HV，厚度26μm，结合力32N，表面能62.9mJ/平方公尺，表面粗糙度1.175μm。
It plaies an important role to study on supramolecular assemblies organized by coordinate-covalent bonding, n-n stacking, charger-transfer, van der Walls force or other intermolecular interactions for advanced functional materials with unusual optical, electric, and magnetic properties.
通过各种配位键、荷电基团的静电作用、非键电子排斥作用、氢键、π-π堆积、电荷转移作用、范德华力等分子间作用力构筑的超分子配位金属聚合物，由于其可能具有独特的光、电、磁性质，而成为当今高新技术材料发展的一个重要方向。
Prior to use of it, apply a layer of special purposeinterface agent to enhance affiniTY bonding force of polymer and extrusion piastic panel
具有抗冲击韧性和足够的应变性能使用前并对板面涂刷专用界面处理剂，藉以增强聚合物砂浆与挤塑板的亲合粘结力。
The bonding between plating layer and base body, plating layer surface morphology were observed by SEM, and the hardness, bonding force and corro...
结果表明，所得镀层平整、光亮、致密，与基体结合牢固，可有效保护镁合金免遭腐蚀。
When coated with the point force a little more than repeated several times back and forth as far as possible, be sure to make slurry with the base surface bonding dense, missed the end, without leaving any air bubbles and trachoma.
涂覆时要稍用点力尽量来回多反复几次，务必使浆料与基面粘接密实，不漏底，不留气泡和沙眼。
FTIR spectroscopy indicated that OZO could coordinate with Li(superscript +) cation in the LiClO4-OZO system through Li-O bonding. A big coordinate cation was formed and the coulombic force was weakened. Meanwhile, Li-O coordination could also lead to the breakage of hydrogen bonding between OZO molecules, resulting in the decrease of the eutectic temperature of the system compared with pure salt. Some the molten salt samples existed as liquid state at room temperature.
红外光谱分析表明OZO通过Li-O键与LiClO4中Li配位而破坏了LiClO4的离子键，形成很大的配位阳离子，削弱了阴阳离子间的库伦作用力；同时Li-O配位也导致OZO分子间的氢键断裂，因而体系的共熔温度较之纯物质熔点显著降低，部分样品室温下以液体状态稳定存在。
FTIR spectroscopy indicated that OZO could coordinate with Li+ cation in the LiClO4-OZO system through Li—O bonding. A big coordinate cation was formed and the coulombic force was weakened. Meanwhile, Li—O coordination could also lead to the breakage of hydrogen bonding between OZO molecules, resulting in the decrease of the eutectic temperature of the system compared with pure salt. Some the molten salt samples existed as liquid state at roomtemperature.
红外光谱分析表明OZO 通过Li—O 键与LiClO4中Li+配位而破坏了LiClO4的离子键，形成很大的配位阳离子，削弱了阴阳离子间的库伦作用力；同时Li—O 配位也导致OZO 分子间的氢键断裂，因而体系的共熔温度较之纯物质熔点显著降低，部分样品室温下以液体状态稳定存在。
The driving force that dominates their packing behaviors is hydrogen bonding generated from adjacent partial protonated surfactants.
当pH值逐渐降低时，二羧酸两性分子的两个酸基将会逐渐地被质子化，这将会使二羧酸两性分子间的静电排斥力变小以及堆积参数变大，进而产生一较低曲率的囊胞聚集物，甚至是酸皂的沉淀。
Using acetylene torch to make tin pewter welding rod melting and bonding with the tin surface to improve the bonding force.
采用氧乙炔火焰将锡锑轴承合金焊条熔化结合在锡表面，以提高两者的结合力。